Introduction of IV and CV graph using data units
For the metal semiconductor, the Schottky diode is the
common name, and it is work function among the metal and the semiconductor,
which also calculates that the junction is rectifying or ohmic. Schottky diodes
are useful in electronic devices due to its stability [1]. The focus of the lab
experiment is on the fabrication of the Schottky diode along with the characteristics
which they posses. The Schottky diode is rectifying like a current, which can
flow only in one direction. It also has lower power losses and high frequencies,
which create them ideal for different applications. For power application the
Schottky diode has been long attractive through virtue of the reduced power
loss in the forward conduction. The Schottky diodes are the mostly carrier
devices which is exhibit the recertifying characteristics plus it also has low
on the state voltage. On the top of n-type which is also known as the epitaxial
layer Schottky barrier is formed. By using
the drift equation and the poisson equation the IV characteristics of the
Schottky diode are formed. The bulk semiconductor potential variations are near
to metal semiconductor contact and are estimated by current as the function of bias
by Schottky diode [2].
Figure1.
Structure of n-type silicon Scotty diode [3]
The Schottky diode is also known as the hot carrier’s diode
and it is the semiconductor by the very fast switching actions which is also
has the low forward voltage drop. By the Schottky diode when current flows
there is the small voltage drops, which across the terminals of the diode. The
ranges of the voltage drop in the Schottky diode between 0.15 and 0.45 volts
but in the normal diode the voltage drop is 0.6 to 1.7 volts. If the voltage
drop is lower it provide the higher switching speed by the better system of efficacy,
but in the Schottky diode the metal junction of the semiconductor is formed
among the metal of semiconductor as well as the metal is creating the Schottky
driver. The semiconductor which has the N-type cathode it affects the metal
side like the anode of the diode.
Aims
and Objectives of IV and CV graph using
data units
· In this lab experiment,
the objective of lab is to obtain the IV characteristic curve of Schottky diode
· The next objective of the
lab is to obtain the CV characteristic curve of Schottky diode
· Elaborate the Fabrication
of Schottky diode
Experimental
section / fabrication of Schottky diodes
By using the research grade of 4H-SiC as well as
6H-SiC samples, the Schottky diode was fabricated. There is a little number of
combinations by the slightly doped of C face and Si face that were tried. Due
to the high electron mobility the 4H polytype is dominant, and the nitrogen is
also dopant for the substrates. The Schottky diode is the great commercial
interest that is used for the different applications. For the high temperature
and the high power the SiC Schottky diode is used, and it is also potentially significant
for commercial devices. To explore the devices characteristics the Al- Schottky
diode has the lateral and vertical contacts that are designed. Fabrication of
Schottky diode in the research grade, n-type. Surface cleaned and the slightly
opened n-type semi conducting was tested [4]. In the standard
CMOS the fabrication of Schottky diode adding the additional CMOS process. The
design of the Schottky diode is fabricated by the Multi project Wafer which is
chartered 0.35 CMOS process [5]. When the metal
layer is deposited the Schottky diode is formed on the low doped p-type or
n-type semiconductor region. The cross section of the Al Schottky diode is
shown in the below figure 2.
Figure 2: cross section of Al-Si Schottky
Source: [6]
There are the following details steps for the
fabrication of the Schottky diode is given below;
By
hot probe method, testing the type of dopant
Chemical
Polishing or Etching
Wafer
cleaning
Metallization
Photolithography
Device-separation
Lead
contact [7]
When the Schottky barrier is reverse biased
then it causes the barrier energy that is also increase and preventing the flow
of electrons across the devices. The Schottky barrier is the forward biased due
to the barrier of energy which is also decreased the allowing current to flow
across the devices. In the lab for taking the CV measurements the Schottky
barrier is characterize the threshold for the voltage or the inversion layers,
when the gate voltages of applied to the structure of gate. The fabrication of the
Schottky diodes which is based on the polymers of the semiconducting, and in
this communication the characterization of the Schottky diode which is based on
the composites. By the thin film of the aluminium
on the back side of the wafer along with copper which has different circles on front
sides of the wafer by masked of oxide along with contact of the oxide. The IV characteristics were
used to extract the electrical parameters, which include barrier height,
ideality factor, and saturation current.
References of IV and CV graph using data units
[1]
|
B. L. SMITH, “Schottky barriers on p-type
silicon,” Solid-State Electronics, vol. 14, no. 1, p. 71–75, 1971.
|
[2]
|
P. Kaushal and e. al, “Current–voltage
characteristics of Schottky diode simulated using semiconductor device
equations,” International Journal of Electronics, vol. 100, no. 5,
p. 686–698, 2013.
|
[3]
|
U. Mishra and e. al, Semiconductor Device Physics
and Design, Springer Science & Business Media,, 2007.
|
[4]
|
N. Alampara, “Fabrication of SiC Schottky diode
and its characterization,” Centre for Nanoscience and Nanotechnology,
School of Physics, Bharathidasan University, Tiruchirappalli, 2019.
|
[5]
|
M. D. Barlow, “Metal-Semiconductor Contacts for
Schottky Diode Fabrication,” YOUNGSTOWN STATE UNIVERSITY, 2007.
|
[6]
|
Q. Li, “Fabrication of Schottky Diode in Standard
CMOS Process,” (State Key Lab of ASIC&System, Fudan University, Shang
Hai 200433), 2018.
|
[7]
|
Ö. Güllü and e. al, “Fabrication and electrical
characteristics of Schottky diode based on organic material,” Microelectronic
Engineering, vol. 85, no. 7, p. 1647–1651, 2008.
|